4/1/2023 0 Comments Solder paste for reflow![]() We welcome your questions you can contact us directly. IPG can assist you to improve the overall processing and manufacturability of your board as well as help lower its total applied cost. First, there are many excellent articles and tutorials on Paste-In-Hole processing, but one that we have found to be particularly helpful is PIHR (Paste In Hole Reflow) Technology by Bob WillisĪlso, Samtec’s Interconnect Processing Group (IPG) is an in-house staff of engineers to support your interconnect processing concerns. ![]() But instead of doing that, let me share some links to other web sites that may be of benefit. Therefore, depending on the connector geometry, some may not be suitable for paste in hole technology on boards thicker than 0.062″ (1.57 mm).Īt this point we could dive into a bunch of gory details about the specifics of PIH soldering. Please note that boards thicker than 0.062″ (1.57 mm) require larger stencil apertures to provide the needed solder volume. 0.062″ printed circuit board thickness, unless otherwise notedīelow is a typical PIH recommended stencil for 2mm pitch header strips.The nominal plated through-hole diameter found on the connector footprint.Samtec’s stencil aperture recommendations are calculated using: Samtec provides the recommended stencil aperture and plated through-hole sizes for most connector series capable of being processed using Paste-In-Hole technology on the connector footprint. This vertical and horizontal space is required to allow unobstructed transfer of the molten paste from the pcb surface into the plated through hole. Second, the vertical and horizontal clearance around the leads must be large enough to allow adequate printed solder paste volume. It is a no-clean solder paste specifically designed for robustness in reflow. To be a candidate for paste in hole soldering, a connector must meet two requirements.įirst, the insulator body material must be capable of withstanding lead and/or lead-free reflow temperatures. Kester EP256 is a paste solder developed for high volume SMT reflow soldering. PIH makes it easier to process double sided boards, especially with taller components.The strength of the PIH solder joint is comparable to those of traditional through hole solder joints.It also saves money because, again, there is only one process – reflow only.It saves time because it employs only one process – reflow only.The boards are run through a reflow soldering process, thus terminating both through-hole and SMT components in one reflow process. Very simply put, this is the process of screening solder paste into and around plated through-holes on a pcb, and placing the leads of through-hole components - like connectors - in these prepared through-holes. ![]() Many Samtec customers employ Paste-In-Hole (PIH) processing. ![]()
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